Company Filing History:
Years Active: 2010-2015
Title: The Innovations of Lay Yeap Lim
Introduction
Lay Yeap Lim is a prominent inventor based in Penang, Malaysia. He has made significant contributions to the field of semiconductor technology. With a total of 5 patents to his name, Lim has established himself as a key figure in the industry.
Latest Patents
One of his latest patents is focused on a semiconductor die package and the method for making the same. This innovative semiconductor die package includes a premolded substrate, which can have a semiconductor die attached to it. An encapsulating material may be disposed over the semiconductor die, enhancing the package's functionality and reliability.
Career Highlights
Lim is currently employed at Fairchild Semiconductor Corporation, where he continues to develop cutting-edge technologies. His work has been instrumental in advancing semiconductor packaging solutions, which are critical for modern electronic devices.
Collaborations
Throughout his career, Lim has collaborated with notable colleagues, including David Chong and Oseob Jeon. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Lay Yeap Lim's contributions to semiconductor technology and his impressive portfolio of patents highlight his role as a leading inventor in the field. His work continues to influence the industry and pave the way for future advancements.