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For the Inventor, By the Inventor

San Jose, CA, United States of America

Chung-Lin Wu

This inventor holds 41 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Fairchild Semiconductor Corporation, Semiconductor Components Industries, LLC. Active years: 2004-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung-Lin Wu. Retrieved from https://idiyas.com/inventor/chung-lin-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 41 

% Patents Active = 80.5

 

Average Co-Inventor Count = 3.6

ph-index = 11

Forward Citations = 563(Granted Patents)


Location History:

  • San Jose, CA (2022)
  • San Jose, CA (US) (2004 - 2023)

Company Filing History:

goldMedal36 out of 1,302 
 
Fairchild Semiconductor Corporation
 patents
silverMedal5 out of 3,725 
 
Semiconductor Components Industries, LLC
 patents

Years Active: 2004-2025

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Areas of Expertise:
Electronic Device Packaging
Galvanic Isolation
Circuit Assemblies
Substrate Interposer
Semiconductor Device
Thermal Management
High-Power Packages
Multi-Chip Module
Wafer Level Packaging
Flip Chip
Lead Frame Structure
Integrated Heat-Sink
41 patents (USPTO):Explore Patents
1. 12278169 - Electronic device packaging with galvanic isolation (2025-04-14),
2. 11735508 - Vertical and horizontal circuit assemblies (2023-08-22),
3. 11296069 - Substrate interposer on a leaderframe (2022-04-05),
4. 11177203 - Vertical and horizontal circuit assemblies (2021-11-16),
5. 11004777 - Semiconductor device assemblies (2021-05-11),
6. 10943855 - Electronic device packaging with galvanic isolation (2021-03-09),
7. 10546847 - Substrate interposer on a leadframe (2020-01-28),
8. 10446498 - Isolation between semiconductor components (2019-10-15),
9. 10256178 - Vertical and horizontal circuit assemblies (2019-04-09),
10. 9735112 - Isolation between semiconductor components (2017-08-15),
11. 9536800 - Packaged semiconductor devices and methods of manufacturing (2017-01-03),
12. 9478519 - Package including a semiconductor die and a capacitive component (2016-10-25),
13. 9379045 - Common drain power clip for battery pack protection mosfet (2016-06-28),
14. 9177925 - Apparatus related to an improved package including a semiconductor die (2015-11-03),
15. 9159656 - Semiconductor die package and method for making the same (2015-10-13),

Title: The Innovative Journey of Chung-Lin Wu

Introduction: Chung-Lin Wu, a talented inventor based in San Jose, CA, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Chung-Lin Wu's latest patents focus on advancements in artificial intelligence algorithms for autonomous vehicles, revolutionizing the way we approach transportation and safety on the roads.

Career Highlights: With a career spanning over two decades, Chung-Lin Wu has worked with leading tech companies in Silicon Valley, spearheading research and development projects that have led to the creation of cutting-edge technologies.

Collaborations: Throughout his career, Chung-Lin Wu has collaborated with top engineers, scientists, and researchers in the industry, fostering a culture of innovation and excellence in all his projects.

Conclusion: Chung-Lin Wu's passion for innovation and his dedication to pushing the boundaries of technology make him a true pioneer in the field of inventions. His work continues to inspire and shape the future of technological advancements worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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