The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Nov. 27, 2013
Applicant:

Fairchild Semiconductor Corporation, San Jose, CA (US);

Inventors:

Ahmad R. Ashrafzadeh, Morgan Hill, CA (US);

Vijay G. Ullal, Saratoga, CA (US);

Justin Chiang, Piedmont, CA (US);

Daniel Kinzer, El Segundo, CA (US);

Michael M. Dube, Saco, ME (US);

Oseob Jeon, Seoul, KR;

Chung-Lin Wu, San Jose, CA (US);

Maria Cristina Estacio, Lapulapu, PH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/64 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 23/3121 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 25/16 (2013.01); H01L 23/145 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1532 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/19107 (2013.01);
Abstract

In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.


Find Patent Forward Citations

Loading…