The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Nov. 04, 2021
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Jerome Teysseyre, Scottsdale, AZ (US);
Romel Manatad, Liloan, PH;
Chung-Lin Wu, San Jose, CA (US);
Bigildis Dosdos, San Jose, CA (US);
Erwin Ian Almagro, Lapu-Lapu, PH;
Maria Cristina Estacio, Lapulapu, PH;
SEMICONDUCTOR COMONENTS INDUTRIES, LLC, Phoenix, AZ (US);
Abstract
In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.