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For the Inventor, By the Inventor

Scottsdale, AZ, United States of America

Jerome Teysseyre

USPTO Granted Patents = 43 

 

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 122(Granted Patents)


Location History:

  • Phoenix, AZ (US) (2019)
  • Singapore, SG (2014 - 2022)
  • Ang Mo Kio, SG (2015 - 2022)
  • Scottsdale, AZ (US) (2020 - 2024)

Company Filing History:

goldMedal30 out of 3,593 
 
Semiconductor Components Industries, LLC
 patents
silverMedal10 out of 2,870 
 
Stmicroelectronics Gmbh
 patents
bronzeMedal3 out of 1,302 
 
Fairchild Semiconductor Corporation
 patents
4. 2 out of 619 
 
Stmicroelectronics (grenoble 2) Sas
 patents
where one patent can have more than one assignee

Years Active: 2014-2025

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Areas of Expertise:
Semiconductor Device Modules
SiC MOSFET Packages
Power Module Package
Direct Cooling Modules
Molded Packaging
3D Semiconductor Packages
Microelectronic Gas Sensors
Heat Transfer Technologies
Vertical Circuit Assemblies
Integrated Circuit Assemblies
Proximity Sensors
Land Grid Array Packages
43 patents (USPTO):Explore Patents
1. 12471204 - Semiconductor device modules (2025-11-11),
2. 12463103 - SiC MOSFET semiconductor packages and related methods (2025-11-04),
3. D1098055 - Power module package (2025-10-14),
4. 12266590 - Dual side direct cooling semiconductor package (2025-04-01),
5. 12230551 - Immersion direct cooling modules (2025-02-18),
6. 12205918 - Submodule semiconductor package (2025-01-21),
7. 12142551 - Package including multiple semiconductor devices (2024-11-12),
8. 12087677 - Molded packaging for wide band gap semiconductor devices (2024-09-10),
9. 12074160 - Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads (2024-08-27),
10. 11984424 - Semiconductor packages using package in package systems and related methods (2024-05-14),
11. 11935817 - Power device module with dummy pad die layout (2024-03-19),
12. 11908826 - Flexible clip with aligner structure (2024-02-20),
13. 11848320 - Power module package for direct cooling multiple power modules (2023-12-19),
14. 11810775 - High power module package structures (2023-11-07),
15. 11735508 - Vertical and horizontal circuit assemblies (2023-08-22),

Title: Jerome Teysseyre: Pioneering Inventor from Scottsdale

Introduction: Jerome Teysseyre is a renowned inventor based in Scottsdale, Arizona, known for his groundbreaking contributions to various industries.

Latest Patents: Jerome Teysseyre holds several patents in the fields of renewable energy, sustainable technology, and consumer electronics, showcasing his innovative spirit and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Jerome Teysseyre has established himself as a leading figure in the world of inventions, with a focus on creating solutions that blend technology with environmental consciousness.

Collaborations: Throughout his career, Jerome Teysseyre has collaborated with top research institutions, universities, and companies to bring his inventions to life, fostering a culture of innovation and progress.

Conclusion: Jerome Teysseyre's passion for innovation and dedication to creating a positive impact through his inventions make him a true pioneer in the field, inspiring the next generation of inventors to push the boundaries of what is possible.

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