Scottsdale, AZ, United States of America

Jerome Teysseyre

This inventor holds 46 USPTO granted patents and 4 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Semiconductor Components Industries, LLC, Stmicroelectronics Gmbh, Fairchild Semiconductor Corporation. Active years: 2014-2026.

USPTO Granted Patents = 46 (Patent Applications = 4)

% Patents Active = 95.7

EPO Patents = 1 (Patent Applications = 3)

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 137(Granted Patents)

Location History:

Phoenix, AZ (US) (2019)
Singapore, SG (2014 - 2022)
Ang Mo Kio, SG (2015 - 2022)
Scottsdale, AZ (US) (2020 - 2024)

Company Filing History:

33 out of 3,714

Semiconductor Components Industries, LLC

patents

10 out of 2,891

Stmicroelectronics Gmbh

patents

3 out of 1,302

Fairchild Semiconductor Corporation

patents

4. 2 out of 646

Stmicroelectronics (Grenoble 2) Sas

patents

where one patent can have more than one assignee

Years Active: 2014-2026

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Areas of Expertise:

Semiconductor Packages

Power Module

SiC MOSFET

Thermal Management

Direct Cooling

3D Packaging

Integrated Sensors

Circuit Assemblies

Molded Packaging

Heat Transfer

Substrate Interposer

Device Modules

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12672556 - Clips for semiconductor package and related methods (2026-06-30),

2. 12642153 - Discrete dual pads for a circuit (2026-05-26),

3. 12543579 - Dual side cooled power module with three-dimensional direct bonded metal substrates (2026-02-03),

4. 12471204 - Semiconductor device modules (2025-11-11),

5. 12463103 - SiC MOSFET semiconductor packages and related methods (2025-11-04),

6. D1098055 - Power module package (2025-10-14),

7. 12266590 - Dual side direct cooling semiconductor package (2025-04-01),

8. 12230551 - Immersion direct cooling modules (2025-02-18),

9. 12205918 - Submodule semiconductor package (2025-01-21),

10. 12142551 - Package including multiple semiconductor devices (2024-11-12),

11. 12087677 - Molded packaging for wide band gap semiconductor devices (2024-09-10),

12. 12074160 - Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads (2024-08-27),

13. 11984424 - Semiconductor packages using package in package systems and related methods (2024-05-14),

14. 11935817 - Power device module with dummy pad die layout (2024-03-19),

15. 11908826 - Flexible clip with aligner structure (2024-02-20),

Title: Jerome Teysseyre: Pioneering Inventor from Scottsdale

Introduction: Jerome Teysseyre is a renowned inventor based in Scottsdale, Arizona, known for his groundbreaking contributions to various industries.

Latest Patents: Jerome Teysseyre holds several patents in the fields of renewable energy, sustainable technology, and consumer electronics, showcasing his innovative spirit and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Jerome Teysseyre has established himself as a leading figure in the world of inventions, with a focus on creating solutions that blend technology with environmental consciousness.

Collaborations: Throughout his career, Jerome Teysseyre has collaborated with top research institutions, universities, and companies to bring his inventions to life, fostering a culture of innovation and progress.

Conclusion: Jerome Teysseyre's passion for innovation and dedication to creating a positive impact through his inventions make him a true pioneer in the field, inspiring the next generation of inventors to push the boundaries of what is possible.