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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12463103 B1

PDFFull Text
Date of Patent:
Nov. 04, 2025

Filed:

Feb. 22, 2023

Sic mosfet semiconductor packages and related methods

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Maria Cristina Estacio, Lapulapu, PH;

Jerome Teysseyre, Scottsdale, AZ (US);

Elsie Agdon Cabahug, Consolacion, PH;

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);

Attorney:

IPTechLaw

Primary Examiner:

Steven B Gauthier

Assistant Examiner:

Sun Mi Kim undefined King

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 21/565 (2013.01); H01L 23/367 (2013.01); H01L 23/49524 (2013.01); H01L 23/49582 (2013.01); H01L 24/09 (2013.01); H10D 62/8325 (2025.01); H01L 2224/02379 (2013.01);
Abstract

A semiconductor package is disclosed. Specific implementations of a semiconductor package may include: one or more semiconductor die coupled between a baseframe and a clip, the baseframe including a gate pad of the baseframe coupled with a gate pad of the one or more semiconductor die, and a source pad of the baseframe coupled with a source pad of the one or more semiconductor die, where the gate pad of the baseframe extends beyond a perimeter of the one or more semiconductor die.

Find Patent Forward Citations

Estacio, Maria. (2025). Sic mosfet semiconductor packages and related methods (U.S. Patent No. 12463103). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12463103

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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