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For the Inventor, By the Inventor

Cebu, Philippines

Elsie Agdon Cabahug

This inventor holds 15 USPTO granted patents and 3 published patent applications. Top assignees: Semiconductor Components Industries, LLC, Fairchild Semiconductor Corporation, Other. Active years: 2002-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Elsie Agdon Cabahug. Retrieved from https://idiyas.com/inventor/elsie-agdon-cabahug

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 86.7

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 197(Granted Patents)


Location History:

  • Mandaue, PH (2002 - 2011)
  • Cebu, PH (2020 - 2022)
  • Consolacion, PH (2021 - 2024)

Company Filing History:

goldMedal8 out of 3,725 
 
Semiconductor Components Industries, LLC
 patents
silverMedal6 out of 1,302 
 
Fairchild Semiconductor Corporation
 patents
bronzeMedal1 out of 834,513 
Other
 patents

Years Active: 2002-2025

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15 patents (USPTO):Explore Patents
1. 12463103 - SiC MOSFET semiconductor packages and related methods (2025-11-04),
2. 12300583 - Concealed gate terminal semiconductor packages and related methods (2025-05-13),
3. 12051635 - Semiconductor device package with clip interconnect and dual side cooling (2024-07-30),
4. 11791247 - Concealed gate terminal semiconductor packages and related methods (2023-10-17),
5. 11621203 - SiC MOSFET semiconductor packages and related methods (2023-04-04),
6. 11616006 - Semiconductor package with heatsink (2023-03-28),
7. 11296069 - Substrate interposer on a leaderframe (2022-04-05),
8. 11088046 - Semiconductor device package with clip interconnect and dual side cooling (2021-08-10),
9. 10546847 - Substrate interposer on a leadframe (2020-01-28),
10. 8058107 - Semiconductor die package using leadframe and clip and method of manufacturing (2011-11-15),
11. 7906837 - Robust leaded molded packages and methods for forming the same (2011-03-15),
12. 7560311 - Robust leaded molded packages and methods for forming the same (2009-07-14),
13. 7285849 - Semiconductor die package using leadframe and clip and method of manufacturing (2007-10-23),
14. 7122884 - Robust leaded molded packages and methods for forming the same (2006-10-17),
15. 6391687 - Column ball grid array package (2002-05-21),

Title: The Innovative Journey of Elsie Agdon Cabahug

Introduction: Elsie Agdon Cabahug is a pioneering inventor hailing from Cebu, Philippines, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Elsie Agdon Cabahug holds several patents in the areas of renewable energy technologies, sustainable agriculture solutions, and smart home devices, showcasing her versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Elsie Agdon Cabahug has worked with leading research institutions and universities to develop cutting-edge inventions that have had a significant impact on various industries.

Collaborations: Throughout her career, Elsie Agdon Cabahug has collaborated with multinational companies, government agencies, and fellow inventors to bring her ideas to life and create real-world solutions to complex challenges.

Conclusion: Elsie Agdon Cabahug's passion for innovation and her dedication to creating a more sustainable and technologically advanced world have solidified her reputation as a trailblazing inventor in the Philippines and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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