The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Apr. 14, 2003
Elsie Agdon Cabahug, Mandaue, PH;
Marvin Rosalejos Gestole, Lapulapu, PH;
Margie Sebial Tumulak-rios, Mandaue, PH;
Lilith U. Montayre, Cebu, PH;
Romel N. Manatad, Mandaue, PH;
Elsie Agdon Cabahug, Mandaue, PH;
Marvin Rosalejos Gestole, Lapulapu, PH;
Margie Sebial Tumulak-Rios, Mandaue, PH;
Lilith U. Montayre, Cebu, PH;
Romel N. Manatad, Mandaue, PH;
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die attach region. A semiconductor die is mounted to the die attach region. A molding material passes through the aperture and covers the first surface of the semiconductor die and the die attach region.