The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
Nov. 18, 2005
Applicants:
Erwin Victor R. Cruz, Koronadal, PH;
Elsie Cabahug, Mandaue, PH;
Ti Ching Shian, Penang, MY;
Venkat Iyer, Cupertino, CA (US);
Inventors:
Erwin Victor R. Cruz, Koronadal, PH;
Elsie Cabahug, Mandaue, PH;
Ti Ching Shian, Penang, MY;
Venkat Iyer, Cupertino, CA (US);
Assignee:
Fairchild Semiconductor Corporation, South Portland, ME (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).