The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Jul. 09, 2019
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Maria Clemens Ypil Quinones, Cebu, PH;
Elsie Agdon Cabahug, Consolacion, PH;
Jerome Teysseyre, Scottsdale, AZ (US);
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/3114 (2013.01); H01L 23/4951 (2013.01); H01L 23/49555 (2013.01); H01L 23/49575 (2013.01);
Abstract
According to an aspect, a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die coupled to the second surface of the substrate, and a molding encapsulating the semiconductor die and a majority of the substrate, where at least a portion of the first surface is exposed through the molding such that the substrate is configured to function as a heat sink.