The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Jan. 08, 2020
Applicant:

Fairchild Semiconductor Corporation, Phoenix, AZ (US);

Inventors:

Elsie Agdon Cabahug, Cebu, PH;

Marie Clemens Ypil Quinones, Cebu, PH;

Maria Cristina Estacio, Lapulapu, PH;

Romel Nogas Manatad, Cebu, PH;

Chung-Lin Wu, San Jose, CA;

Jerome Teysseyre, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/49531 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 25/0655 (2013.01); H01L 23/3107 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/181 (2013.01);
Abstract

In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made of an insulating material, and a redistribution layer coupled to the interposer and made of a conductive material. The redistribution layer can include a plurality of traces. The device can also include a semiconductor die disposed between the redistribution layer and the leadframe.


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