The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Jan. 22, 2021
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Maria Clemens Ypil Quinones, Cebu City, PH;
Bigildis Dosdos, San Jose, CA (US);
Jerome Teysseyre, Scottsdale, AZ (US);
Erwin Ian Vamenta Almagro, Lapu-Lapu City, PH;
Romel N Manatad, Liloan, PH;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Abstract
A semiconductor device package may include a leadframe having a first portion with first extended portions and a second portion with second extended portions. Mold material may encapsulate a portion of the leadframe and a portion of a semiconductor die mounted to the leadframe. A first set of contacts of the semiconductor die may be connected to a first surface of the first extended portions, while a second set of contacts may be connected to a first surface of the second extended portions. A mold-locking cavity having the mold material included therein may be disposed in contact with a second surface of the first extended portions opposed to the first surface of the first extended portions, a second surface of the second extended portions opposed to the first surface of the second extended portions, the first portion of the leadframe, and the second portion of the leadframe.