The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
May. 24, 2022
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Jooyang Eom, Gimpo-si, KR;
Seungwon Im, Seoul, KR;
Maria Cristina Estacio, Lapulapu, PH;
Jerome Teysseyre, Scottsdale, AZ (US);
Inpil Yoo, Unterhaching, DE;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 24/20 (2013.01); H01L 23/3735 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 23/49575 (2013.01); H01L 24/83 (2013.01); H01L 25/072 (2013.01); H01L 2224/2101 (2013.01); H01L 2224/211 (2013.01); H01L 2224/214 (2013.01); H01L 2224/2201 (2013.01); H01L 2224/221 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83091 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/182 (2013.01); H01L 2924/3512 (2013.01);
Abstract
Implementations of semiconductor devices may include a die coupled over a lead frame, a redistribution layer (RDL) coupled over the die, a first plurality of vias coupled between the RDL and the die, and a second plurality of vias coupled over and directly to the lead frame. The second plurality of vias may be adjacent to an outer edge of the semiconductor device and may be electrically isolated from the die.