The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Nov. 23, 2012
Applicant:

Rajeev Joshi, Cupertino, CA (US);

Inventor:

Rajeev Joshi, Cupertino, CA (US);

Assignee:

Flextronics AP, LLC, Broomfield, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01); H01F 41/00 (2006.01);
U.S. Cl.
CPC ...
H01F 41/00 (2013.01);
Abstract

Embodiments of the present invention relate to a method of forming a magnetics package. The method includes providing a primary coil configured to conduct a current flow; providing a substrate having a surface and a secondary coil extending from the surface, the secondary coil configured to conduct a current flow; encapsulating the secondary coil in a secondary mold compound; removing the substrate from the secondary coil, thereby leaving the secondary coil embedded in the secondary mold compound; and inductively coupling the secondary coil to the primary coil through a magnetic core, the secondary coil is electrically isolated from the primary coil, wherein a current flow in the primary coil produces a magnetic field in the magnetic core, and the magnetic field in the magnetic core induces a current flow in the secondary coil.


Find Patent Forward Citations

Loading…