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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11430722 B1

PDFFull Text
Date of Patent:
Aug. 30, 2022

Filed:

Apr. 11, 2018

Integration of a passive component in a cavity of an integrated circuit package

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Jeffrey Morroni, Parker, TX (US);

Rajeev Dinkar Joshi, Cupertino, CA (US);

Sreenivasan K. Koduri, Allen, TX (US);

Sujan Kundapur Manohar, Dallas, TX (US);

Yogesh K. Ramadass, San Jose, CA (US);

Anindya Poddar, Sunnyvale, CA (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Dawn Jos

Charles A. Brill

Frank D. Cimino

Primary Examiner:

Hrayr A Sayadian

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49589 (2013.01); H01L 21/4828 (2013.01); H01L 23/49861 (2013.01); H01L 24/07 (2013.01); H01L 23/49548 (2013.01); H01L 23/50 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/30105 (2013.01);
Abstract

A semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and a passive component electrically connected to the semiconductor die through the leadframe. The leadframe includes a cavity in a side of the leadframe opposite the semiconductor die, and at least a portion of the passive component resides within the cavity in a stacked arrangement.

Find Patent Forward Citations

Morroni, Jeffrey. (2022). Integration of a passive component in a cavity of an integrated circuit package (U.S. Patent No. 11430722). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11430722

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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