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For the Inventor, By the Inventor

San Diego, CA, United States of America

Pratyush Kamal

USPTO Granted Patents = 16 

 

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 101(Granted Patents)


Company Filing History:

goldMedal16 out of 41,326 
 
Qualcomm Incorporated
 patents

Years Active: 2013-2022

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16 patents (USPTO):
1. 11444068 - Three-dimensional (3D) integrated circuit device having a backside power delivery network (2022-09-13),
2. 10121743 - Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC) (2018-11-06),
3. 10062680 - Silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) standard library cell circuits having a gate back-bias rail(s), and related systems and methods (2018-08-28),
4. 9929733 - Connection propagation for inter-logical block connections in integrated circuits (2018-03-27),
5. 9754923 - Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) (2017-09-05),
6. 9537471 - Three dimensional logic circuit (2017-01-03),
7. 9508615 - Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits (2016-11-29),
8. 9213358 - Monolithic three dimensional (3D) integrated circuit (IC) (3DIC) cross-tier clock skew management systems, methods and related components (2015-12-15),
9. 9147438 - Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) with vertical memory components, related systems and methods (2015-09-29),
10. 9123721 - Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace (2015-09-01),
11. 9093995 - Length-of-diffusion protected circuit and method of design (2015-07-28),
12. 9053960 - Decoupling capacitor for integrated circuit (2015-06-09),
13. 9013235 - Monolithic three dimensional (3D) flip-flops with minimal clock skew and related systems and methods (2015-04-21),
14. 8836040 - Shared-diffusion standard cell architecture (2014-09-16),
15. 8610176 - Standard cell architecture using double poly patterning for multi VT devices (2013-12-17),

Title: Pratyush Kamal: Innovator in Integrated Circuit Technology

Introduction

Pratyush Kamal is a prominent inventor based in San Diego, California. He has made significant contributions to the field of integrated circuit technology, holding a total of 16 patents. His work focuses on enhancing the efficiency and performance of integrated circuits, particularly in three-dimensional configurations.

Latest Patents

Among his latest patents is a groundbreaking design for a three-dimensional (3D) integrated circuit device featuring a backside power delivery network. This innovative integrated circuit (IC) package includes a power delivery network, a first die with dual surfaces, and a second die positioned on the first die. Additionally, the package incorporates bumps that connect to contact pads of the power delivery network, optimizing power distribution. Another notable patent addresses power distribution networks in 3D integrated circuits, aiming to minimize voltage drop and unnecessary power dissipation. This is achieved by increasing the thickness of interconnect layers dedicated to power distribution and strategically placing vias to enhance connectivity between different tiers.

Career Highlights

Pratyush Kamal is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His role involves developing advanced technologies that push the boundaries of integrated circuit design and functionality. His extensive experience and innovative mindset have positioned him as a key player in the field.

Collaborations

Throughout his career, Pratyush has collaborated with notable colleagues

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