The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

May. 09, 2016
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jing Xie, San Diego, CA (US);

Kambiz Samadi, San Diego, CA (US);

Pratyush Kamal, San Diego, CA (US);

Yang Du, Carlsbad, CA (US);

Javid Jaffari, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); G06F 17/50 (2006.01); H01L 23/48 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G06F 17/5072 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 24/13 (2013.01); H01L 27/0688 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13025 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/141 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/14335 (2013.01);
Abstract

Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) are disclosed. Exemplary aspects of the present disclosure contemplate consolidating power gating circuits or cells into a single tier within a 3DIC. Still further, the power gating circuits are consolidated in a tier closest to a voltage source. This closest tier may include a backside metal layer that allows a distance between the voltage source and the power gating circuits to be minimized. By minimizing the distance between the voltage source and the power gating circuits, power loss from routing elements therebetween is minimized. Further, by consolidating the power gating circuits in a single tier, routing distances between the power gating circuits and downstream elements may be minimized and power loss from those routing elements are minimized. Other advantages are likewise realized by placement of the power gating circuits according to exemplary aspects of the present disclosure.


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