IDiyas

For the Inventor, By the Inventor

San Diego, CA, United States of America

Kambiz Samadi

USPTO Granted Patents = 17 

 

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 99(Granted Patents)


Company Filing History:

goldMedal17 out of 41,326 
 
Qualcomm Incorporated
 patents

Years Active: 2015-2021

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17 patents (USPTO):
1. 11004780 - Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro (2021-05-11),
2. 10510651 - Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro (2019-12-17),
3. 10192813 - Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro (2019-01-29),
4. 10176147 - Multi-processor core three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods (2019-01-08),
5. 10121743 - Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC) (2018-11-06),
6. 9929733 - Connection propagation for inter-logical block connections in integrated circuits (2018-03-27),
7. 9754923 - Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) (2017-09-05),
8. 9741691 - Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC) (2017-08-22),
9. 9629233 - Techniques for implementing a synthetic jet to cool a device (2017-04-18),
10. 9626311 - Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms (2017-04-18),
11. 9508615 - Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits (2016-11-29),
12. 9483598 - Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits (2016-11-01),
13. 9147438 - Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) with vertical memory components, related systems and methods (2015-09-29),
14. 9123721 - Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace (2015-09-01),
15. 9098666 - Clock distribution network for 3D integrated circuit (2015-08-04),

Title: Kambiz Samadi: Pioneering Innovations in Integrated Circuits

Introduction: Kambiz Samadi, a prolific inventor based in San Diego, CA, is a true pioneer in the world of inventions, known for his relentless pursuit of innovation and his passion for pushing the boundaries of technology. With an impressive 17 patents to his name, Samadi has made significant contributions to the field of integrated circuits.

Latest Patents: Among his latest patents is the "Hard Macro Having Blockage Sites, Integrated Circuit Including Same and Method of Routing Through a Hard Macro." This innovative technology features a hard macro with a periphery defining a hard macro area, along with a series of vias extending through the hard macro thickness. This cutting-edge design allows for enhanced connectivity and efficiency in integrated circuits.

Career Highlights: Samadi currently works at Qualcomm Incorporated, a leading technology company known for its advancements in wireless technology. Within Qualcomm, Samadi has spearheaded numerous projects focusing on integrated circuit design and optimization, solidifying his reputation as a top innovator in the industry.

Collaborations: Throughout his career, Kambiz Samadi has collaborated with esteemed colleagues such as Yang Du and Pratyush Kamal. Together, they have worked on groundbreaking projects that have shaped the future of integrated circuits and semiconductor technology.

Conclusion: Kambiz Samadi's dedication to innovation and his groundbreaking work in the field of integrated circuits have cemented his legacy as a true pioneer. With his unwavering passion for technological advancement, Samadi continues to drive forward the boundaries of what is possible in the world of inventions.

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