Growing community of inventors

San Diego, CA, United States of America

Kambiz Samadi

Average Co-Inventor Count = 3.66

ph-index = 5

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 99

Kambiz SamadiYang Du (16 patents)Kambiz SamadiPratyush Kamal (6 patents)Kambiz SamadiShreepad Amar Panth (6 patents)Kambiz SamadiJing Xie (5 patents)Kambiz SamadiSung Kyu Lim (4 patents)Kambiz SamadiRobert P Gilmore (3 patents)Kambiz SamadiMehdi Saeidi (1 patent)Kambiz SamadiAmin Ansari (1 patent)Kambiz SamadiRajat Mittal (1 patent)Kambiz SamadiArpit Mittal (1 patent)Kambiz SamadiJavid Jaffari (1 patent)Kambiz SamadiKaramvir Chatha (1 patent)Kambiz SamadiEmil Rahim (1 patent)Kambiz SamadiKambiz Samadi (17 patents)Yang DuYang Du (41 patents)Pratyush KamalPratyush Kamal (16 patents)Shreepad Amar PanthShreepad Amar Panth (6 patents)Jing XieJing Xie (10 patents)Sung Kyu LimSung Kyu Lim (6 patents)Robert P GilmoreRobert P Gilmore (39 patents)Mehdi SaeidiMehdi Saeidi (24 patents)Amin AnsariAmin Ansari (23 patents)Rajat MittalRajat Mittal (20 patents)Arpit MittalArpit Mittal (14 patents)Javid JaffariJavid Jaffari (9 patents)Karamvir ChathaKaramvir Chatha (5 patents)Emil RahimEmil Rahim (3 patents)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Qualcomm Incorporated (17 from 41,572 patents)


17 patents:

1. 11004780 - Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

2. 10510651 - Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

3. 10192813 - Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

4. 10176147 - Multi-processor core three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods

5. 10121743 - Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC)

6. 9929733 - Connection propagation for inter-logical block connections in integrated circuits

7. 9754923 - Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs)

8. 9741691 - Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)

9. 9626311 - Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms

10. 9629233 - Techniques for implementing a synthetic jet to cool a device

11. 9508615 - Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits

12. 9483598 - Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits

13. 9147438 - Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) with vertical memory components, related systems and methods

14. 9123721 - Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace

15. 9098666 - Clock distribution network for 3D integrated circuit

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