The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Aug. 28, 2013
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Pratyush Kamal, San Diego, CA (US);

Yang Du, Carlsbad, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H03K 3/037 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
H03K 3/0372 (2013.01); G06F 17/5068 (2013.01);
Abstract

Monolithic three dimensional (3D) flip-flops with minimal clock skew and related systems and methods are disclosed. The present disclosure provides a 3D integrated circuit (IC) (3DIC) that has a flop spread across at least two tiers of the 3DIC. The flop is split across tiers with transistor partitioning in such a way that keeps all the clock related devices at the same tier, thus potentially giving better setup, hold and clock-to-q margin. In particular, a first tier of the 3DIC has the master latch, slave latch, and clock circuit. A second tier has the input circuit and the output circuit.


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