IDiyas

For the Inventor, By the Inventor

Singapore, Singapore

Pradeep Yelehanka

USPTO Granted Patents = 30 

Average Co-Inventor Count = 4.4

ph-index = 7

Forward Citations = 331(Granted Patents)


Company Filing History:

goldMedal15 out of 962 
 
Chartered Semiconductor Manufacturing Ltd (corporation)
 patents
silverMedal14 out of 1,016 
 
Globalfoundries Singapore Pte. Ltd.
 patents
bronzeMedal1 out of 19 
 
Vanguard International Semiconductor Singapore Pte. Ltd.
 patents

Years Active: 2005-2020

where 'Filed Patents' based on already Granted Patents

30 patents (USPTO):
1. 10793421 - Wafer level encapsulation for MEMS device (2020-10-06),
2. 10301171 - Wafer level packaging for MEMS device (2019-05-28),
3. 9932224 - Semiconductor devices with cavities and methods for fabricating semiconductor devices with cavities (2018-04-03),
4. 9620373 - Methods for fabricating semiconductor or micromachined devices with metal structures and methods for forming self-aligned deep cavity metal structures (2017-04-11),
5. 9272899 - Bonding method using porosified surfaces for making stacked structures (2016-03-01),
6. 8940616 - Bonding method using porosified surfaces for making stacked structures (2015-01-27),
7. 8536705 - Integrated circuit system with through silicon via and method of manufacture thereof (2013-09-17),
8. 8513767 - Package interconnects (2013-08-20),
9. 8394724 - Processing with reduced line end shortening ratio (2013-03-12),
10. 8304834 - Semiconductor local interconnect and contact (2012-11-06),
11. 8283263 - Integrated circuit system including nitride layer technology (2012-10-09),
12. 8236688 - Integrated circuit system with through silicon via and method of manufacture thereof (2012-08-07),
13. 8236646 - Non-volatile memory manufacturing method using STI trench implantation (2012-08-07),
14. 7964894 - Integrated circuit system employing stress memorization transfer (2011-06-21),
15. 7960282 - Method of manufacture an integrated circuit system with through silicon via (2011-06-14),

Title: Pradeep Yelehanka: Innovator in MEMS Technology

Introduction

Pradeep Yelehanka is a prominent inventor based in Singapore, known for his significant contributions to the field of microelectromechanical systems (MEMS). With a remarkable portfolio of 30 patents, Yelehanka has established himself as a leading figure in advancements related to MEMS devices.

Latest Patents

Among his latest innovations, Yelehanka has developed two notable patents:

1. **Wafer Level Encapsulation for MEMS Device**: This invention details a MEMS device that comprises a device substrate with a MEMS component housed in a designated device region. The design includes a top cap and a bottom cap that are fusion bonded to the substrate, ensuring robust encapsulation of the MEMS components. Specifically, the caps incorporate a via isolation, extending their thickness and surrounding the device region.

2. **Wafer Level Packaging for MEMS Device**: This patent describes a similar MEMS device with improvements in the bonding process. It features a top device bond ring and a bottom device bond ring designed to encapsulate the MEMS component using eutectic bonds that enhance the durability and efficiency of the packaging.

Career Highlights

Pradeep Yelehanka has had a distinguished career, having worked with some notable corporations in the semiconductor manufacturing industry, including Chartered Semiconductor Manufacturing Ltd and Globalfoundries Singapore Pte. Ltd. His professional journey reflects a deep commitment to advancing MEMS technology and improving microfabrication techniques.

Collaborations

Throughout his career, Yelehanka has collaborated with talented professionals, including Jia Zhen Zheng and Weining Li. These collaborations have undoubtedly contributed to his innovative approaches and successful patent filings.

Conclusion

Pradeep Yelehanka's body of work highlights his stature as an innovator in MEMS technology. With his extensive patent portfolio and collaborative spirit, he continues to play a crucial role in shaping the future of microelectromechanical systems and their applications across various industries.

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