The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Jan. 07, 2015
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Rama Krishna Kotlanka, Singapore, SG;

Rakesh Kumar, Singapore, SG;

Premachandran Chirayarikathuveedu Sankarapillai, Clifton Park, NY (US);

Huamao Lin, Singapore, SG;

Pradeep Yelehanka, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); B81B 7/00 (2006.01); H01L 21/50 (2006.01); B81C 1/00 (2006.01); B81C 3/00 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0006 (2013.01); B81C 1/00269 (2013.01); B81C 3/001 (2013.01); H01L 21/50 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); B81C 2201/0115 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.


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