The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Mar. 21, 2011
Rama Krishna Kotlanka, Singapore, SG;
Rakesh Kumar, Singapore, SG;
Premachandran Chirayarikathuveedu Sankarapillai, Singapore, SG;
Pradeep Ramachandramurthy Yelehanka, Singapore, SG;
Rama Krishna Kotlanka, Singapore, SG;
Rakesh Kumar, Singapore, SG;
Premachandran Chirayarikathuveedu Sankarapillai, Singapore, SG;
Pradeep Ramachandramurthy Yelehanka, Singapore, SG;
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Abstract
A method for forming a device is disclosed. A support substrate having first and second major surfaces is provided. An interconnect is formed through the first and second major surfaces in the support substrate. The interconnect has first and second portions. The first portion extends from one of the first or second major surfaces and the second portion extends from the other of the first and second major surfaces. The interconnect includes a partial via plug having a conductive material in a first portion of the interconnect. The via plug has a bottom at about an interface of the first and second portions. The second portion of the interconnect is heavily doped with dopants of a first polarity type.