The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Nov. 13, 2017
Applicant:

Vanguard International Semiconductor Singapore Pte. Ltd., Singapore, SG;

Inventors:

Natarajan Rajasekaran, Singapore, SG;

Siddharth Chakravarty, New York, NY (US);

Yu Ting Ng, Singapore, SG;

Rakesh Kumar, Singapore, SG;

Pradeep Yelehanka, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H01L 21/67 (2006.01); B81C 1/00 (2006.01); B81B 7/04 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0077 (2013.01); B81B 7/04 (2013.01); B81C 1/00269 (2013.01); B81C 1/00301 (2013.01); H01L 21/67 (2013.01); B81B 2207/095 (2013.01); B81C 2203/0118 (2013.01);
Abstract

A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate having a MEMS component in a device region. A top cap is fusion bonded to the top surface of the device substrate and a bottom cap is fusion bonded to the bottom surface of the device substrate. The top and bottom caps encapsulate the MEMS components. A cap includes a via isolation which extends a thickness of the cap and surrounds the device region.


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