Topsfield, MA, United States of America

Paul Lefevre

This inventor holds 12 USPTO granted patents and 1 EPO patent. Top assignees: Innopad, Inc., Fns Tech Co., Ltd.. Active years: 2011-2017.


% Patents Active = 41.7

 

Average Co-Inventor Count = 5.2

ph-index = 3

Forward Citations = 53(Granted Patents)


Company Filing History:


Years Active: 2011-2017

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12 patents (USPTO):Explore Patents

Title: Paul Lefevre: Innovator in Chemical-Mechanical Planarization Technology

Introduction

Paul Lefevre is a notable inventor based in Topsfield, MA (US), recognized for his contributions to the field of chemical-mechanical planarization. With a total of 12 patents to his name, Lefevre has made significant advancements in the technology used for polishing substrates in various industries.

Latest Patents

Lefevre's latest patents include innovative designs for chemical-mechanical planarization pads. One of his patents describes a multi-layered chemical-mechanical planarization pad that incorporates both water-soluble and water-insoluble compositions. This pad is designed to enhance the efficiency of the polishing process by utilizing fibers in its construction. Another patent focuses on a chemical-mechanical planarization pad that features patterned structural domains, allowing for improved polishing capabilities by incorporating regularly spaced discrete elements within a continuous domain.

Career Highlights

Throughout his career, Paul Lefevre has worked with several companies, including Innopad, Inc. and FNS Tech Co., Ltd. His experience in these organizations has contributed to his expertise in developing advanced polishing technologies.

Collaborations

Lefevre has collaborated with notable professionals in his field, including Oscar K. Hsu and David Adam Wells. These collaborations have further enriched his work and led to innovative solutions in chemical-mechanical planarization.

Conclusion

Paul Lefevre's contributions to the field of chemical-mechanical planarization are significant, with a focus on developing advanced polishing pads that enhance substrate processing. His innovative patents and collaborations reflect his commitment to advancing technology in this area.

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