The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Oct. 02, 2008
Paul Lefevre, Topsfield, MA (US);
David Adam Wells, Hudson, NH (US);
Marc C. Jin, Boston, MA (US);
Oscar K. Hsu, Chelmsford, MA (US);
John Erik Aldeborgh, Boxford, MA (US);
Scott Xin Qiao, Macungie, PA (US);
Anoop Mathew, Peabody, MA (US);
Guangwei Wu, Sunnyvale, CA (US);
Paul Lefevre, Topsfield, MA (US);
David Adam Wells, Hudson, NH (US);
Marc C. Jin, Boston, MA (US);
Oscar K. Hsu, Chelmsford, MA (US);
John Erik Aldeborgh, Boxford, MA (US);
Scott Xin Qiao, Macungie, PA (US);
Anoop Mathew, Peabody, MA (US);
Guangwei Wu, Sunnyvale, CA (US);
Innopad, Inc., Wilmington, MA (US);
Abstract
A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.