The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Sep. 29, 2010
Paul Lefevre, Topsfield, MA (US);
Oscar K. Hsu, Chelmsford, MA (US);
David Adam Wells, Hudson, NH (US);
John Erik Aldeborgh, Boxford, MA (US);
Marc C. Jin, Boston, MA (US);
Guangwei Wu, Sunnyvale, CA (US);
Anoop Mathew, Peabody, MA (US);
Paul Lefevre, Topsfield, MA (US);
Oscar K. Hsu, Chelmsford, MA (US);
David Adam Wells, Hudson, NH (US);
John Erik Aldeborgh, Boxford, MA (US);
Marc C. Jin, Boston, MA (US);
Guangwei Wu, Sunnyvale, CA (US);
Anoop Mathew, Peabody, MA (US);
FNS Tech Co., Ltd., Cheonan-si, KR;
Abstract
A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L) at the surface to a second land length (L) at the surface, wherein the second land length (L) is less than the first land length (L) and the grooves have a second width (W) wherein (W)≦(X)(W), wherein (X) has a value in the range of 0.01 to 0.75.