The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2013

Filed:

Oct. 23, 2008
Applicants:

Paul Lefevre, Topsfield, MA (US);

Oscar K. Hsu, Chelmsford, MA (US);

David Adam Wells, Hudson, NH (US);

Marc C. Jin, Boston, MA (US);

John Erik Aldeborgh, Boxford, MA (US);

Inventors:

Paul Lefevre, Topsfield, MA (US);

Oscar K. Hsu, Chelmsford, MA (US);

David Adam Wells, Hudson, NH (US);

Marc C. Jin, Boston, MA (US);

John Erik Aldeborgh, Boxford, MA (US);

Assignee:

Innopad, Inc., Wilmington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cmto 1000 interconnecting junction points/cm, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.


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