Richardson, TX, United States of America

Nazila Dadvand

This inventor holds 52 USPTO granted patents and 22 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2019-2025.

USPTO Granted Patents = 52 (Patent Applications = 22)

% Patents Active = 100.0

EPO Patents = 2 (Patent Applications = 2)

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 24(Granted Patents)

Forward Citations (Not Self Cited) = 9(Dec 10, 2025)

Location History:

Santa Clara, CA (US) (2023)
Richardson, TX (US) (2019 - 2024)
Sunnyvale, CA (US) (2023 - 2024)

Company Filing History:

52 out of 29,869

Texas Instruments Corporation

patents

Years Active: 2019-2025

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Areas of Expertise:

Semiconductor Packaging

Copper Plating

Thermal Management

Die Attach

Flip-Chip Redistribution

Multi-Pitch Leads

Nanostructures

Metal-Alloy Interfaces

Conductive Layers

Bronze Material

Filler Particles

Wafer Layers

52 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12476173 - Electronic device with post mold plated nickel tungsten and tin bilayer for improved board level reliability (2025-11-18),

2. 12312703 - Neutral pH copper plating solution for undercut reduction (2025-05-27),

3. 12237219 - Contact with bronze material to mitigate undercut (2025-02-25),

4. 12180595 - Chemically anchored mold compounds in semiconductor packages (2024-12-31),

5. 12154845 - Semiconductor package with nickel-silver pre-plated leadframe (2024-11-26),

6. 12139569 - Filler particles for polymers (2024-11-12),

7. 12074096 - Die attach surface copper layer with protective layer for microelectronic devices (2024-08-27),

8. 12068221 - Plating for thermal management (2024-08-20),

9. 11984418 - Method of forming brass-coated metals in flip-chip redistribution layers (2024-05-14),

10. 11938715 - -bonded carbon structures (2024-03-26),

11. 11935821 - Quad flat no-lead package with wettable flanges (2024-03-19),

12. 11908776 - Semiconductor device with metal die attach to substrate with multi-size cavity (2024-02-20),

13. 11854933 - Thermally conductive wafer layer (2023-12-26),

14. 11848258 - Semiconductor package with nickel-silver pre-plated leadframe (2023-12-19),

15. 11694947 - Multi-pitch leads (2023-07-04),

Title: The Innovative Journey of Nazila Dadvand

Introduction: Nazila Dadvand, a pioneering inventor based in Richardson, TX, has made significant contributions to the field of technology with her groundbreaking innovations.

Latest Patents: Nazila Dadvand's most recent patents include a cutting-edge software application for enhancing cybersecurity measures in cloud computing systems and a revolutionary algorithm for optimizing energy consumption in smart homes.

Career Highlights: With a background in computer science and a passion for problem-solving, Nazila Dadvand has established herself as a leading figure in the tech industry. Throughout her career, she has received numerous accolades for her innovative solutions to complex technological challenges.

Collaborations: Nazila Dadvand has collaborated with top research institutions and leading tech companies to further develop and implement her inventions. Her ability to work across disciplines and industries has led to the successful integration of her technologies into various applications.

Conclusion: Nazila Dadvand's relentless pursuit of innovation and her dedication to pushing the boundaries of technology have solidified her reputation as a trailblazing inventor in Richardson, TX, and beyond. Her work continues to inspire the next generation of inventors to think boldly and create solutions that shape the future.