The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Aug. 09, 2022
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Vivek Swaminathan Sridharan, Dallas, TX (US);
Christopher Daniel Manack, Flower Mound, TX (US);
Nazila Dadvand, Sunnyvale, CA (US);
Salvatore Frank Pavone, Houston, TX (US);
Patrick Francis Thompson, Allen, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02317 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03502 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05618 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/11424 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11848 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13618 (2013.01); H01L 2224/13647 (2013.01); H01L 2924/0132 (2013.01);
Abstract
A method for manufacturing a package includes positioning a copper layer above a die. A zinc layer is positioned on the copper layer. The zinc and copper layers are then heated to produce a brass layer, the brass layer abutting the copper layer. Further, a polymer layer is positioned abutting the brass layer.