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For the Inventor, By the Inventor

Murphy, TX, United States of America

Salvatore Frank Pavone

This inventor holds 27 USPTO granted patents and 10 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2009-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Salvatore Frank Pavone. Retrieved from https://idiyas.com/inventor/salvatore-frank-pavone

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 100.0


Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 17(Granted Patents)


Location History:

  • Murphy, TX (US) (2009 - 2024)
  • Houston, TX (US) (2024)

Company Filing History:

goldMedal27 out of 29,888 
 
Texas Instruments Corporation
 patents

Years Active: 2009-2025

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Areas of Expertise:
Flip Chip Packages
Thermal Management
Copper Wire Bonding
Nickel Alloys
Solder Bond Applications
Microelectronic Devices
Barrier Layers
Die Attach
Capacitor Integration
Multilayer Dielectric
Zinc-Cobalt Barrier
Brass-Coated Metals
27 patents (USPTO):Explore Patents
1. 12237219 - Contact with bronze material to mitigate undercut (2025-02-25),
2. 12100678 - Conductive members for die attach in flip chip packages (2024-09-24),
3. 12074096 - Die attach surface copper layer with protective layer for microelectronic devices (2024-08-27),
4. 12068221 - Plating for thermal management (2024-08-20),
5. 11984418 - Method of forming brass-coated metals in flip-chip redistribution layers (2024-05-14),
6. 11948871 - Process for thin film capacitor integration (2024-04-02),
7. 11876065 - Flip chip package assembly (2024-01-16),
8. 11855024 - Wafer chip scale packages with visible solder fillets (2023-12-26),
9. 11594504 - Nickel alloy for semiconductor packaging (2023-02-28),
10. 11587858 - Zinc-cobalt barrier for interface in solder bond applications (2023-02-21),
11. 11443996 - Zinc layer for a semiconductor die pillar (2022-09-13),
12. 11410947 - Brass-coated metals in flip-chip redistribution layers (2022-08-09),
13. 11362020 - Flipchip package with an IC having a covered cavity comprising metal posts (2022-06-14),
14. 11127515 - Nanostructure barrier for copper wire bonding (2021-09-21),
15. 11011488 - Zinc-cobalt barrier for interface in solder bond applications (2021-05-18),

Title: Inventor Salvatore Frank Pavone

Introduction: Salvatore Frank Pavone is a renowned inventor based in Murphy, Texas. He is known for his innovative contributions to various fields.

Latest Patents: Salvatore Frank Pavone holds several patents in the areas of technology and engineering, showcasing his dedication to advancing these industries.

Career Highlights: Throughout his career, Salvatore Frank Pavone has demonstrated a keen ability to develop groundbreaking solutions to complex problems. His work has significantly impacted the way we approach technological challenges.

Collaborations: Salvatore Frank Pavone has collaborated with leading experts in the field, further enhancing his innovative projects and bringing his ideas to life through strategic partnerships.

Conclusion: Salvatore Frank Pavone's passion for innovation and his commitment to pushing the boundaries of technology make him a standout figure in the world of inventors. His contributions continue to inspire and drive progress in various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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