The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Oct. 30, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Christopher Daniel Manack, Flower Mound, TX (US);

Salvatore Frank Pavone, Murphy, TX (US);

Maricel Fabia Escaño, Angeles, PH;

Rafael Jose Lizares Guevara, Metro Manila, PH;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/81815 (2013.01);
Abstract

In examples, a semiconductor package comprises a semiconductor die having an active surface; a conductive layer coupled to the active surface; and a polyimide layer coupled to the conductive layer. The package also comprises a conductive pillar coupled to the conductive layer and to the polyimide layer; a flux adhesive material coupled to the conductive pillar; and a solder layer coupled to the flux adhesive material. The package further includes a conductive terminal coupled to the solder layer and exposed to a surface of the package, the active surface of the semiconductor die facing the conductive terminal.


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