Company Filing History:
Years Active: 2021-2024
Title: Innovations by Maricel Fabia Escaño
Introduction: Maricel Fabia Escaño, an accomplished inventor based in Angeles, Philippines, has made significant strides in the field of semiconductor technology. With three patents to her name, she exemplifies the innovative spirit that drives advancements in technology.
Latest Patents: Among her latest innovations are two notable patents. The first patent, titled "Conductive Members for Die Attach in Flip Chip Packages," describes a semiconductor package that includes a conductive layer coupled to the active surface of a semiconductor die and a polyimide layer. This invention aims to enhance the efficiency and reliability of semiconductor packages. The second patent, "Semiconductor Chip Packages Having Bond Over Active Circuit (BOAC) Structures," outlines a method for forming a conductive member on a seed layer that enhances performance by ensuring optimal connectivity in semiconductor applications.
Career Highlights: Maricel has been affiliated with Texas Instruments Corporation, where she has contributed her expertise to the development of groundbreaking technologies in semiconductor fabrication and packaging. Her role in the company underscores her commitment to excellence and innovation in the tech industry.
Collaborations: Throughout her career, Maricel has collaborated with esteemed colleagues, including Rafael Jose Lizares Guevara and Arvin Cedric Quiambao Mallari. These collaborations have fostered a rich environment of creativity and technical advancement, allowing her to drive forward-thinking solutions in her projects.
Conclusion: Maricel Fabia Escaño stands out as a remarkable inventor whose contributions to semiconductor technology continue to pave the way for future innovations. Her patents and collaborative efforts reflect her dedication to improving the industry and exemplify the important role of women in STEM fields.