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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11239190 B1

PDFFull Text
Date of Patent:
Feb. 01, 2022

Filed:

Jan. 09, 2020

Solder-metal-solder stack for electronic interconnect

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Rafael Jose Lizares Guevara, Manila, PH;

Maricel Fabia Escaño, Angeles, PH;

Arvin Cedric Quiambao Mallari, San Fernando, PH;

Jovenic Romero Esquejo, Baguio, PH;

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Ronald O. Neerinqs

Charles A. Brill

Frank D. Cimino

Primary Examiner:

William A Harriston

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 101/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); B23K 35/0222 (2013.01); B23K 35/262 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/4951 (2013.01); H01L 24/11 (2013.01); B23K 2101/40 (2018.08); H01L 2224/11462 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13008 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13084 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01);
Abstract

An electronic device includes a substrate having top side contact pads including metal pillars thereon or a laminate substrate having land pads with the pillars thereon. A solder including layer stack is on the pillars, the solder including layer stack having a bottom solder material layer including in physical contact with a top surface of the pillars, a metal material layer, and a capping solder material layer on the metal material layer. The metal material layer is primarily a copper layer or an intermetallic compound (IMC) layer including copper.

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