The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Sep. 30, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/027 (2013.01); H01L 24/04 (2013.01); H01L 24/11 (2013.01); H01L 2221/1068 (2013.01); H01L 2224/022 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/014 (2013.01); H01L 2924/177 (2013.01);
Abstract

In a described example, an apparatus includes: a semiconductor die having a device side surface; bond pads on the semiconductor die on the device side surface; post connects having a proximate end on the bond pads and extending from the bond pads to a distal end, the diameter of the post connects at the proximate end being the same as the diameter of the post connects at the distal end; polyimide material covering sides of the post connects and covering at least a portion of the bond pads; and solder bumps on the distal end of the post connects.


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