The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Apr. 28, 2023
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Nazila Dadvand, Santa Clara, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 2224/48247 (2013.01);
Abstract

An electronic device includes a semiconductor die, a package structure enclosing the semiconductor die, and a conductive lead having first and second surfaces. The first surface has a bilayer exposed along a side of the package structure, and the second surface is exposed along another side of the package structure. The bilayer includes first and second plated layers, the first plated layer on and contacting the first surface of the conductive lead and the second plated layer on and contacting the first plated layer and exposed along the side of the package structure, where the first plated layer includes nickel tungsten, and the second plated layer includes tin.


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