The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Feb. 28, 2022
Texas Instruments Incorporated, Dallas, TX (US);
Nazila Dadvand, Sunnyvale, CA (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
In some examples, a semiconductor package comprises a semiconductor die including a device side having a circuit formed therein and a conductive member coupled to the circuit and having multiple layers. The conductive member includes: a titanium tungsten layer coupled to the circuit; a copper seed layer coupled to the titanium tungsten layer; a copper layer coupled to the copper seed layer; a nickel tungsten layer coupled to the copper layer; and a plated layer coupled to the nickel tungsten layer. The semiconductor package includes a bond wire coupled to the plated layer; and a conductive terminal coupled to the bond wire and exposed to an exterior surface of the semiconductor package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile