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For the Inventor, By the Inventor

Wuhan, China

Meng Yan

This inventor holds 13 USPTO granted patents and 6 published patent applications and 1 EPO patent. Top assignees: Yangtze Memory Technologies Co., Ltd., Huawei Technologies Co., Limited, Yangtze Memory Technologies., Ltd.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng Yan. Retrieved from https://idiyas.com/inventor/meng-yan-6a943nq3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13 

% Patents Active = 92.3

 

Average Co-Inventor Count = 2.2

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Hubei, CN (2020 - 2024)
  • Wuhan, CN (2020 - 2024)

Company Filing History:

goldMedal11 out of 1,190 
 
Yangtze Memory Technologies Co., Ltd.
 patents
silverMedal1 out of 27,557 
 
Huawei Technologies Co., Limited
 patents
bronzeMedal1 out of 299 
 
Yangtze Memory Technologies., Ltd.
 patents

Years Active: 2020-2026

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13 patents (USPTO):Explore Patents
1. 12588495 - Bonding alignment marks at bonding interface (2026-03-24),
2. 12507406 - 3D memory device (2025-12-23),
3. 12482786 - Hybrid wafer bonding method (2025-11-25),
4. 12463177 - Hybrid wafer bonding method and structure thereof (2025-11-04),
5. 12432295 - Method, electronic device, and system for creating application shortcut (2025-09-30),
6. 11996322 - Method for forming lead wires in hybrid-bonded semiconductor devices (2024-05-28),
7. 11876049 - Bonding alignment marks at bonding interface (2024-01-16),
8. 11670543 - Method for forming lead wires in hybrid-bonded semiconductor devices (2023-06-06),
9. 11502058 - Hybrid wafer bonding method and structure thereof (2022-11-15),
10. 11322392 - Method for forming lead wires in hybrid-bonded semiconductor devices (2022-05-03),
11. 11289422 - Bonding alignment marks at bonding in interface (2022-03-29),
12. 10763158 - Method for forming lead wires in hybrid-bonded semiconductor devices (2020-09-01),
13. 10692756 - Method for forming dual damascene interconnect structure (2020-06-23),

Title: Inventor Meng Yan - Revolutionizing Technology in Wuhan

Introduction: Meng Yan is a visionary inventor based in Wuhan, China, known for his groundbreaking contributions to the field of technology.

Latest Patents: Meng Yan holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Meng Yan has worked with leading tech companies in Wuhan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Meng Yan has collaborated with top research institutions and universities in Wuhan, fostering a culture of innovation and knowledge-sharing to drive progress in the technological landscape.

Conclusion: Meng Yan's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a prominent figure in the inventor community, with his work continuing to inspire future generations of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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