The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
May. 03, 2022
Yangtze Memory Technologies Co., Ltd., Hubei, CN;
Yangtze Memory Technologies Co., Ltd., Hubei, CN;
Abstract
Embodiments of a hybrid-bonded semiconductor structure are disclosed. The semiconductor structure comprises a first conductive structure and a second conductive structure in a base dielectric layer. The base dielectric layer has a non-flat top surface. A first top surface of the first conductive structure is non-coplanar with a second top surface of the second conductive structure. The semiconductor structure further comprises an alternating dielectric layer stack comprising a plurality of dielectric layers sequentially disposed on the base dielectric layer, wherein at least two of the plurality of dielectric layers have non-uniform thickness. The semiconductor structure further comprises a first lead wire and a second lead wire formed in the alternating dielectric layer stack and electrically connected to the first conductive structure and the second conductive structure, respectively.