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For the Inventor, By the Inventor

Hubei, China

Si Ping Hu

This inventor holds 26 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Semiconductor Technology. Top assignee: Yangtze Memory Technologies Co., Ltd.. Active years: 2020-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Si Ping Hu. Retrieved from https://idiyas.com/inventor/si-ping-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 46(Granted Patents)


Location History:

  • Hubei, CN (2020 - 2024)
  • Wuhan, CN (2020 - 2024)

Company Filing History:

goldMedal26 out of 1,190 
 
Yangtze Memory Technologies Co., Ltd.
 patents

Years Active: 2020-2024

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Areas of Expertise:
Memory Device
Hybrid Bonding
Integrated Wiring
Lead Wires
Three-Dimensional
Bonding Contacts
Capping Layer
Alignment Marks
Fabrication Methods
Interconnects
Word Line Contact
Dummy Bonding
26 patents (USPTO):Explore Patents
1. 12137558 - Staircase structure for memory device (2024-11-05),
2. 12010838 - Staircase structure for memory device (2024-06-11),
3. 11996322 - Method for forming lead wires in hybrid-bonded semiconductor devices (2024-05-28),
4. 11876049 - Bonding alignment marks at bonding interface (2024-01-16),
5. 11791265 - Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof (2023-10-17),
6. 11715718 - Bonding contacts having capping layer and method for forming the same (2023-08-01),
7. 11670543 - Method for forming lead wires in hybrid-bonded semiconductor devices (2023-06-06),
8. 11462503 - Hybrid bonding using dummy bonding contacts (2022-10-04),
9. 11322392 - Method for forming lead wires in hybrid-bonded semiconductor devices (2022-05-03),
10. 11289422 - Bonding alignment marks at bonding in interface (2022-03-29),
11. 11276642 - Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof (2022-03-15),
12. 11205619 - Hybrid bonding using dummy bonding contacts and dummy interconnects (2021-12-21),
13. 11177231 - Bonding contacts having capping layer and method for forming the same (2021-11-16),
14. 11145666 - Staircase structure for memory device (2021-10-12),
15. 11101276 - Word line contact structure for three-dimensional memory devices and fabrication methods thereof (2021-08-24),

Title: The Innovative Journey of Si Ping Hu

Introduction: Si Ping Hu, a visionary inventor hailing from Hubei, China, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Si Ping Hu's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Si Ping Hu has established himself as a pioneer in the tech industry, holding numerous patents that have revolutionized various sectors. His dedication to innovation and problem-solving has earned him recognition on a global scale.

Collaborations: Throughout his career, Si Ping Hu has collaborated with leading research institutions, universities, and tech companies to further his inventions and bring them to market. His ability to work across disciplines has led to the development of groundbreaking technologies that have the potential to shape the future.

Conclusion: Si Ping Hu's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his position as a trailblazer in the world of technology. His inventions continue to inspire and drive progress in the ever-evolving tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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