IDiyas

For the Inventor, By the Inventor

Ibaraki, Japan

Masaki Shiina

USPTO Granted Patents = 14 


Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 91(Granted Patents)


Location History:

  • Kashima-gun, JP (2003 - 2004)
  • Ibarakai, JP (2005)
  • Kamisu, JP (2014 - 2015)
  • Ibaraki, JP (1997 - 2017)

Company Filing History:

goldMedal11 out of 91 
 
Yupo Corporation
 patents
silverMedal2 out of 26 
 
Oji-yuka Synthetic Paper Co., Ltd.
 patents
bronzeMedal1 out of 832,680 
Other
 patents

Years Active: 1997-2017

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14 patents (USPTO):Explore Patents
1. 9633580 - Label for in-mold molding, in-mold molded article and method for molding same (2017-04-25),
2. 9149976 - Label for in-mold forming and resin container with the label (2015-10-06),
3. 8920890 - Label for in-mold forming and resin container with the label (2014-12-30),
4. 8187692 - In-mold label and molded article using the same (2012-05-29),
5. 8021727 - In-mold molding label and molded product using the same (2011-09-20),
6. 7807243 - Label for in-mold forming having excellent delabeling property, and container with the label (2010-10-05),
7. 7514131 - In-mold label with separable part (2009-04-07),
8. 6858283 - Labels for in-mold forming and molded resin products having the same (2005-02-22),
9. 6764760 - Label for in-mold decorating and labeled resin molded article (2004-07-20),
10. 6749915 - Labeled resin bottle (2004-06-15),
11. 6620473 - Label for in-mold decorating (2003-09-16),
12. 6551671 - In-mold label (2003-04-22),
13. 5811163 - In-mold label and container decorated therewith (1998-09-22),
14. 5670225 - Uniaxially stretched multilayered film and air baggage tag containing (1997-09-23),

Title: Masaki Shiina: Innovator in In-Mold Molding Technologies

Introduction

Masaki Shiina is a prominent inventor based in Ibaraki, Japan, known for his significant contributions to the field of in-mold molding technologies. With a total of 14 patents to his name, Shiina has developed innovative solutions that enhance the efficiency and effectiveness of molding processes.

Latest Patents

Shiina's latest patents include a label for in-mold molding, which features a laminate film comprising a substrate layer and a heat-sealable resin layer. The substrate layer consists of a thermoplastic resin and an inorganic fine powder or organic filler, while the heat-sealable resin layer is made of a thermoplastic resin. This innovative label exhibits specific thermal conductivity and bonding strength properties, making it suitable for various applications. Another notable patent is a label for in-mold forming, which includes a thermoplastic resin film base layer, a heat-sealable resin layer, and an antistatic layer. This label is designed to improve the performance of resin containers, showcasing Shiina's commitment to advancing molding technology.

Career Highlights

Throughout his career, Masaki Shiina has worked with reputable companies such as Yupo Corporation and Oji-Yuka Synthetic Paper Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to the development of cutting-edge molding solutions.

Collaborations

Shiina has collaborated with notable coworkers, including Takatoshi Nishizawa and Yasuo Iwasa, further enhancing his innovative capabilities and expanding his impact in the industry.

Conclusion

Masaki Shiina's work in the field of in-mold molding technologies has led to significant advancements, as evidenced by his numerous patents and collaborations. His innovative spirit continues to drive progress in the industry, making him a key figure in the realm of molding technology.

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