The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Jan. 31, 2007
Yasuo Iwasa, Kamisu, JP;
Masaki Shiina, Kamisu, JP;
Takatoshi Nishizawa, Kamisu, JP;
Yupo Corporation, Tokyo, JP;
Abstract
A label for in-mold forming which comprises a thermoplastic resin film base layer (I), a heat-sealable resin layer (II), and an antistatic layer (III), wherein the heat-sealable resin layer (II) comprises a heat-sealable resin including a copolymer of propylene and α-olefin having 4-20 carbon atoms and has a degree of non-crystallinity of 60-90% as determined with a differential scanning calorimeter (DSC) at temperatures less than 90° C., the antistatic layer (III) comprises an antistatic agent in an amount of 0.001 to 1 g per unit area (m) and the surface of the layer has a wettability index (JIS-K-6768) of 32-54 mN/m, and the label has a porosity higher than 10% and not higher than 70% and has an opacity (JIS-P-8138) higher than 20% and not higher than 100%; and a labeled container with the label.