logo

For the Inventor, By the Inventor

Ibaraki, Japan

Takatoshi Nishizawa

This inventor holds 29 USPTO granted patents and 1 published patent application and 3 EPO patents, primarily in In-Mold Labeling. Top assignees: Yupo Corporation, Oji Yuka Goseishi Co., Ltd., Oji-Yuka Synthetic Paper Co., Ltd.. Active years: 1993-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takatoshi Nishizawa. Retrieved from https://idiyas.com/inventor/takatoshi-nishizawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 72.4

 

Average Co-Inventor Count = 2.9

ph-index = 7

Forward Citations = 177(Granted Patents)


Location History:

  • Kamisu-machi, JP (2010)
  • Ibaraki, JP (1993 - 2012)
  • Kashima-gun, JP (2003 - 2012)
  • Kamisu, JP (2014 - 2017)

Company Filing History:

goldMedal18 out of 98 
 
Yupo Corporation
 patents
silverMedal7 out of 29 
 
Oji Yuka Goseishi Co., Ltd.
 patents
bronzeMedal3 out of 26 
 
Oji-Yuka Synthetic Paper Co., Ltd.
 patents
4. 1 out of 834,570 
Other
 patents

Years Active: 1993-2017

Loading Chart...
Loading Chart...
Areas of Expertise:
In-Mold Labeling
Thermal Transfer Recording
Biodegradable Containers
Pressure-Sensitive Adhesive
Void-Containing Thermoplastic
Image-Receiving Sheet
Melt Thermal Transfer
Stretched Resin Film
Delabeling Property
Molded Products
Resin Containers
Air Baggage Tag
29 patents (USPTO):Explore Patents
1. 9636857 - Label for in-mold forming (2017-05-02),
2. 9149976 - Label for in-mold forming and resin container with the label (2015-10-06),
3. 8920890 - Label for in-mold forming and resin container with the label (2014-12-30),
4. 8268415 - Melt thermal transfer recording paper (2012-09-18),
5. 8187692 - In-mold label and molded article using the same (2012-05-29),
6. 8158250 - Stretched film of void-containing thermoplastic resin and process for producing the same (2012-04-17),
7. 8021727 - In-mold molding label and molded product using the same (2011-09-20),
8. 7981503 - Stretched resin film and label comprising the same (2011-07-19),
9. 7862881 - Label for in-mold formation (2011-01-04),
10. 7807243 - Label for in-mold forming having excellent delabeling property, and container with the label (2010-10-05),
11. 7776413 - Melt thermal transfer recording paper (2010-08-17),
12. 7740924 - Labeled resin container (2010-06-22),
13. 7618694 - Biodegradable label for in-mold forming and biodegradable container having the label attached thereto (2009-11-17),
14. 7514131 - In-mold label with separable part (2009-04-07),
15. 6858283 - Labels for in-mold forming and molded resin products having the same (2005-02-22),

Title: The Innovative Journey of Takatoshi Nishizawa

Introduction: Takatoshi Nishizawa, a prolific inventor based in Ibaraki, Japan, has made significant contributions to the field of in-mold forming technology. With an impressive portfolio of 29 patents, Nishizawa has demonstrated an exceptional ability to innovate, particularly in the development of labels and containers that enhance functionality and durability.

Latest Patents: Takatoshi Nishizawa’s latest inventions include a label for in-mold forming, which features a thermoplastic resin film with a heat-sealable layer, a printable thermoplastic resin film, an antenna, and an IC chip. This innovative label is designed to be strong, water-resistant, and possesses a high adhesive strength. Additionally, it serves the dual purpose of functioning as an IC label while providing a printable surface. Remarkably, bonding this label to a thermoplastic resin container does not compromise the integrity of the IC chip and antenna.

Another noteworthy patent involves a detailed specification for a label encompassing a thermoplastic resin film base layer, a heat-sealable resin layer, and an antistatic layer. The heat-sealable resin includes a copolymer of propylene and alpha-olefin, achieving a degree of non-crystallinity between 60-90%. This label also features an optimal wettability index and porosity, making it ideal for a labeled container that meets industry standards.

Career Highlights: Throughout his career, Takatoshi Nishizawa has worked with esteemed companies such as Yupo Corporation and Oji Yuka Goseishi Co., Ltd. His experiences in these organizations have undeniably contributed to his innovative prowess and expertise in patenting new technologies.

Collaborations: Nishizawa has collaborated closely with talented individuals, including Masaki Shiina and Akihiko Ohno. These collaborations have enriched his work and facilitated the creation of groundbreaking inventions in the field of in-mold forming.

Conclusion: With a remarkable collection of 29 patents, Takatoshi Nishizawa stands as a prominent figure in the realm of innovations in labeling and packaging technologies. His inventions reflect a commitment to enhancing product functionality and design, ensuring that he remains a key player in the ongoing evolution of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…