The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Mar. 29, 2006
Masaki Shiina, Ibaraki, JP;
Kazuyuki Kimura, Ibaraki, JP;
Takatoshi Nishizawa, Ibaraki, JP;
Yupo Corporation, Tokyo, JP;
Abstract
The invention provides a label for in-mold forming which tenaciously adheres to molded articles regardless of the materials of the molded articles, is usable under a wide range of molded-article molding conditions, and has an excellent print finish. The invention relates to: a label for in-mold forming, which comprises a resin film comprising a heat-sealable layer and a printing layer, wherein the heat-sealable layer has a rate of surface aperture of 6-30%, the printing layer has a dot skipping of 5% or lower, and the printing layer has a Bekk's surface smoothness (JIS-P-8119) of 650-20,000 seconds; and a molded article using the label.