The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2011

Filed:

Aug. 03, 2004
Applicants:

Takatoshi Nishizawa, Ibaraki, JP;

Hiroshi Koike, Ibaraki, JP;

Inventors:

Takatoshi Nishizawa, Ibaraki, JP;

Hiroshi Koike, Ibaraki, JP;

Assignee:

Yupo Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41M 5/00 (2006.01); B44C 1/17 (2006.01); G03G 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A label for in-mold formation is provided which can be readily delaminated from the container by any one because of its excellent delamination initiation property and delamination transmission property as well as its low interlaminar strength, and which can be recorded with information such as pictures and letters on the inner side concealed by the label, and therefore, enabling effective utilization of the display area, or utilization of the delaminated label portion as a request form or a discount ticket, so called coupon. The present invention discloses a label for in-mold formation which includes a base layer (A) containing a thermoplastic resin, a layer (B) which enables delamination, and a heat seal layer (D) in this order; the aforementioned label for in-mold formation which includes an intermediate layer (C) between the layer (B) which enables delamination and the heat seal layer (D); and a resin molded product with a label to which the label for in-mold formation is attached to integrate with such a resin molded product by thermal fusion.


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