The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Sep. 07, 2006
Applicants:
Yasuo Iwasa, Ibaraki, JP;
Masaki Shiina, Ibaraki, JP;
Takatoshi Nishizawa, Ibaraki, JP;
Inventors:
Assignee:
Yupo Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29D 22/00 (2006.01); B32B 9/00 (2006.01); B32B 3/10 (2006.01); B29C 47/00 (2006.01); B29C 47/88 (2006.01); B29C 43/22 (2006.01); B28B 3/20 (2006.01); D01D 5/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to: a label for in-mold forming having excellent suitability for delabeling which comprises a thermoplastic resin film base layer (I) and a heat-sealable resin layer (II) and in which the heat-sealable resin layer (II) has an adhesion strength as measured at 23° C. of 300 gf/15 mm or higher and an adhesion strength as measured at 90° C. of 290 gf/15 mm or lower; and a labeled resin container having the label bonded thereto.