IDiyas

For the Inventor, By the Inventor

Ibaraki, Japan

Yasuo Iwasa

USPTO Granted Patents = 15 


Average Co-Inventor Count = 2.6

ph-index = 4

Forward Citations = 54(Granted Patents)


Location History:

  • Ibaraki, JP (1999 - 2012)
  • Kamisu, JP (2014 - 2017)

Company Filing History:

goldMedal14 out of 91 
 
Yupo Corporation
 patents
silverMedal1 out of 26 
 
Oji-yuka Synthetic Paper Co., Ltd.
 patents

Years Active: 1999-2017

Loading Chart...
Loading Chart...
15 patents (USPTO):Explore Patents
1. 9636857 - Label for in-mold forming (2017-05-02),
2. 9633580 - Label for in-mold molding, in-mold molded article and method for molding same (2017-04-25),
3. 9149976 - Label for in-mold forming and resin container with the label (2015-10-06),
4. 8920890 - Label for in-mold forming and resin container with the label (2014-12-30),
5. 8187692 - In-mold label and molded article using the same (2012-05-29),
6. 8097338 - In-mold label, and labeled resin-labeled article (2012-01-17),
7. 7910201 - Porous resin film and ink jet recording medium (2011-03-22),
8. 7862884 - Electrophotographic film and recorded material using the same (2011-01-04),
9. 7807243 - Label for in-mold forming having excellent delabeling property, and container with the label (2010-10-05),
10. 7740924 - Labeled resin container (2010-06-22),
11. 7101826 - Recording paper and label paper using the same (2006-09-05),
12. 6984423 - Ink jet recording paper (2006-01-10),
13. 6911253 - Porous resin film (2005-06-28),
14. 6811837 - Porous resin film (2004-11-02),
15. 5871829 - Pressure-sensitive adhesive label (1999-02-16),

Title: Innovations of Yasuo Iwasa

Introduction

Yasuo Iwasa is a prominent inventor based in Ibaraki, Japan, known for his significant contributions to the field of thermoplastic resin technology. With a total of 15 patents to his name, Iwasa has developed innovative solutions that enhance the functionality and durability of various products.

Latest Patents

Among his latest patents is a label for in-mold forming, which comprises a thermoplastic resin film with a heat-sealable layer, a printable thermoplastic resin film, and an integrated antenna and IC chip. This innovative label is designed to be strong and water-resistant, featuring high adhesive strength. It serves the dual purpose of an IC label while providing a printable surface. Additionally, Iwasa has developed a thermoplastic resin container that can bear this label without damaging the IC chip and antenna. Another notable patent is for a label for in-mold molding, which includes a laminate film made up of a substrate layer and a heat-sealable resin layer. This label is engineered to maintain optimal thermal conductivity and bonding strength, making it suitable for various applications.

Career Highlights

Iwasa has worked with notable companies such as Yupo Corporation and Oji-Yuka Synthetic Paper Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in material technology.

Collaborations

Throughout his career, Iwasa has collaborated with talented individuals, including Takatoshi Nishizawa and Masaki Shiina. These partnerships have fostered a creative environment that has led to the development of groundbreaking innovations.

Conclusion

Yasuo Iwasa's work exemplifies the spirit of innovation in the field of thermoplastic resin technology. His patents not only demonstrate his expertise but also contribute to advancements that benefit various industries.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…