The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Oct. 13, 2010
Mitsuhiro Ashikaga, Ibaraki, JP;
Masaki Shiina, Ibaraki, JP;
Yasuo Iwasa, Kamisu, JP;
YUPO CORPORATION, Tokyo, JP;
Abstract
A label for in-mold molding, which comprises a laminate film comprising a substrate layer (A) and a heat-sealable resin layer (B), wherein the substrate layer (A) comprises a thermoplastic resin in an amount of from 40 to 90% by weight and at least one of an inorganic fine powder and an organic filler in an amount of from 10 to 60% by weight, the heat-sealable resin layer (B) comprises a thermoplastic resin in an amount of from 50 to 100% by weight, the laminate film is at least uniaxially stretched, the porosity of the laminate film is from 10% to 45%, the thermal conductivity of the label is from 0.04 to 0.11 W/mK, and the bonding strength of the label stuck to an adherend formed of a propylene-based resin at 200° C. and 60 MPa is from 250 to 1500 g/15 mm.