The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Jun. 29, 2005
Applicants:
Takatoshi Nishizawa, Kamisu, JP;
Yasuo Iwasa, Kamisu, JP;
Inventors:
Takatoshi Nishizawa, Kamisu, JP;
Yasuo Iwasa, Kamisu, JP;
Assignee:
Yupo Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G09F 3/04 (2006.01); B32B 7/02 (2006.01); B32B 7/12 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/32 (2006.01); B29C 45/14 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14836 (2013.01); B29C 45/14811 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/32 (2013.01); G09F 3/04 (2013.01); B29C 45/14647 (2013.01); B29L 2031/3456 (2013.01); B32B 2307/31 (2013.01); B32B 2307/402 (2013.01); B32B 2307/41 (2013.01); B32B 2307/704 (2013.01); B32B 2307/75 (2013.01); B32B 2519/00 (2013.01); Y10T 428/1352 (2015.01);
Abstract
A label for in-mold forming comprising a thermoplastic resin film with a heat-sealable layer, a printable thermoplastic resin film, and an antenna and an IC chip. The antenna and the IC chip are interposed between the thermoplastic resin films. The label is strong and water resistant with a high adhesive strength. The label has the function of an IC label and has a printable surface. Also provided is a thermoplastic resin container bearing the label. Bonding the label to a thermoplastic resin container does not damage the IC chip and antenna.