The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Dec. 16, 2002
Applicants:
Takatoshi Nishizawa, Ibaraki, JP;
Masaki Shiina, Ibarakai, JP;
Akihiko Ohno, Tokyo, JP;
Inventors:
Assignee:
Yupo Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B003/24 ;
U.S. Cl.
CPC ...
Abstract
Disclosed is a label for in-mold forming comprising a thermoplastic resin film base layer and a heat-seal resin layer, wherein a surface of the heat-seal resin layer has a centerline average roughness of 0.5 to 5 micrometers and the label has an air permeability of 10 to 20,000 seconds. When in-mold forming is conducted with the label of the present invention, labeled molded resin articles of various shapes can be manufactured while effectively inhibiting blistering.